As demand for smaller and slimmer mobile phones equipped with more functions to accommodate diversified services grows, the mobile phone industry is faced with the challenge of how to downsize mobile phone components. We have leveraged the strength of our mobile phone module design technology and monolithic microwave integrated circuit (MMIC) technology to build the industry's smallest W-CDMA multiband mobile phone terminal transmission power amplifier. This will make it possible to miniturize 800 MHz, 1.7 GHz and 2 GHz multiband mobile phone terminals.
Industry's smallest package reduces the size of multiband mobile phone terminals.
By employing our original MMIC design technology, we integrated some of the chips that comprise the matching circuit of a transmission power module into the MMIC. With this new structure, we reduced the module size by over 60% to achieve the industry's smallest footprint of 3.0 mm x 3.0 mm while maintaining the same performance as our existing models.
New plastic matching circuit board can make multiband mobile phone terminals slimmer.
We replaced a ceramic matching circuit board from a transmission power module with a plastic matching circuit board that has a lower thermal resistance. With this new structure, we reduced the thickness of the module to 1.0 mm, 16% slimmer than our other models .
Suitable for W-CDMA mobile phone power amplifiers, especially for multiband terminals.
We will continue to work on improving compatibility with more efficient, high-speed communication systems by redesigning the transistor structure while integrating peripheral circuitry into the module.