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| BA01232 |
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| Successfully miniaturized to 0.02cc, while realizing top-level
efficiency 50% and low idle current 35mA. |
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Outline |
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Because of the miniaturization and weight reduction of W-CDMA
system mobile phone terminals, along with the miniaturization of parts, it is
necessary to increase the efficiency and miniaturization of the transmission power
amplifier which consumes most of the current at the time of actuation. Furthermore,
in the W-CDMA system, there are many cases when it uses small output power, so
the reduced idle current (current without high frequency signaling) becomes important.
In our company, due to the module matching circuit and optimized transistor structure,
top-level power efficiency 50% and low idle current 35m A are realized. We have
succeeded in producing a micro transmission power amplifier module miniaturized
in 0.02cc. |
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Features |
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Realizes industry top-level power efficiency 50% to improve
call time with mobile phone terminals
After optimizing module circuitry and the structure and size of transistors, top-level
power efficiency 50% and low idle current of 35mA were realized. |
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Resin sealed package structure allows more compact, low-profile
design and further mobile phone miniaturization
The conventional metal cap is replaced by a resin seal, the built-in chips are
miniaturized and circuit layout optimized, to enable the inclusion of a GaAs HBT
amplifier (2-step configuration) and matching circuit to decrease distortion within
a capacity of 0.02cc (4x4x1.2mm). |
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Applications |
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Ideal as a transmission power amplifier for W-CDMA system mobile
phone terminal. |
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Future deployment |
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In future, we aim to continue miniaturization with the MMIC
(Microwave Monolithic IC), and improve compatibility with more efficient, high-speed
communication systems. |
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