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| BA01241 |
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| Achieved volume of 0.01cc (3 x 3 x 1mm3),
the smallest size in the class in the industry by utilizing GaAs
HBT MMIC |
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Outline |
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Since the modulation method of cellular phone service
and allocated frequency differ by countries and carriers, cellular
phone handsets are equipped with power amplifiers meeting the modulation
method and the frequency of each service. Multi-band cellular phone
handsets intended for use in multiple services require being equipped
with multiple power amplifiers, and miniaturization of power amplifiers
is desired. We have developed power amplifiers compatible with the
United States 800 MHz band N-CDMA method, achieving the smallest
size in the industry. |
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Features |
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By achieving the smallest size in the industry,
miniaturizing multi-band cellular phone handset, making full use
of MMIC engineering technology and changing a portion of the chip
parts to MMIC, we have reduced the number of chip parts and created
the smallest size in the industry with a packaging area of 3mm x
3mm, which is approximately half the existing product. |
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By resining the matching circuit board, it became
possible to configure the multi-band cellular phone handsets by a
resin board with a substrate structure which is slimmer and lighter
with reduced heat resistance, and we have created a slimmer and lighter
product that is 1.0 mm in height and 0.02g in mass. |
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Applications |
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Perfect for power amplifiers for multi-band cellular
phone handset compatible with the United States 800 MHz band N-CDMA
method. |
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In the future, we plan to improve the operation
efficiency further and expand and develop power amplifiers compatible
with the W-CDMA modulation method and other frequency bands. |
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