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Miniaturized and thin
Compatible with narrow-pitch flip-chip mounting |
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Outline |
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Demand is rapidly growing for buildup boards that can carry
several or dozens of semiconductor s and LCRs for modules. Recently, in particular,
the actual examination of 60~80-µm- levelnarrow-pitch flip-chip mounting
has begun, and demand is rising for these highly minute boards as substrates and
interposers for modules . |
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Features |
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Compatible with bare-chip mounting
It has high rigidity, and for a thin board does not twist or bend. Moreover, since
it adopts the all-glass-layer, epoxy-type buildup board which has excellent coplanarity,
it has good flip-chip and wire-bonding bare-chip mounting characteristics.
Module miniaturization possible |
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Module miniaturization is realized by the adoption of the semi-additive
process for copper seed layers and Via technology that enables a wiring width/interval
=25/25µm and Via/land diameter =ø80 /150µm |
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Applications |
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Ideal as a module for data communications terminals, wireless
LAN, Bluetooth, CCD cameras, TFT, digital appliances, etc. |
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Future deployment |
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As a next-generation mounting technology, the module board
substrate is due to be produced commercially for substrates with built-in passive
parts or added passive element functions, such as capacitors and inductors. |
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